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IEC 60749-4:2002 ED1

Apr 2002 Revised

Note: Latest version: IEC 60749-4:2017 ED2

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) Revised IEC 60749-4:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Language: English/French Services: Online, Online + Pdf

Abstract

Provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. The contents of the corrigendum of August 2003 have been included in this copy.

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Standard from IEC
Published: April 12 2002
Withdrawn: March 3 2017
Edition: 1
Document type: IS
Pages
ISBN: 2831862892

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

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Revised by: IEC 60749-4:2017 ED2
Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Replaces: IEC PAS 62177:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-4:2002 ED1

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IEC 60749-4:2017 ED2

IEC 60749-4:2002 ED1

IEC PAS 62177:2000 ED1

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Version history Related Corrigenda and Amendments (1)

IEC 60749-4:2002/COR1:2003 ED1

Version history History (3)

IEC 60749-4:2017 ED2

IEC 60749-4:2002 ED1

IEC PAS 62177:2000 ED1

Abstract

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Product life cycle