Standard

IEC PAS 62177:2000 ED1

Aug 2000 Replaced

Existing or new amendments and versions must be purchased separately.

Language English

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Abstract

The highly-accelerated temperature and humidity stress test is performed for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments. It employs severe conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductors which pass through it.

Products specifications

Standard from IEC
Published: August 24 2000
Withdrawn: July 1 2002
Edition: 1
Document type: PAS
Pages
ISBN: 2831853508

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

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Replaced by: IEC 60749-4:2002 ED1

IEC PAS 62177:2000 ED1

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Abstract

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Abstract

Products specifications

Product Relations

Product life cycle