Standard

IEC 60749-20:2020 ED3

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Existing or new amendments and versions must be purchased separately.

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Abstract

IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 3
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.080.01
  • International TC: TC 47

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