Redline

IEC 60749-20:2020 RLV

Aug 2020 Current

Note: Latest version: IEC 60749-20:2020 ED3

Existing or new amendments and versions must be purchased separately.

Language English

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Abstract

IEC 60749-20:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.

Products specifications

Redline from IEC
Published: August 31 2020
Edition: 3
Document type: IS
Pages
ISBN: 9782832288344

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

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Adopted by: NF EN IEC 62928:2018
Revises: IEC 60749-20:2008 ED2

IEC 60749-20:2020 RLV

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IEC 60749-20:2020 ED3

IEC 60749-20:2008 ED2

IEC 60749-20:2002 ED1

Abstract

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Version history Related Corrigenda and Amendments (0)

Version history History (3)

IEC 60749-20:2020 ED3

IEC 60749-20:2008 ED2

IEC 60749-20:2002 ED1

Abstract

Products specifications

Product Relations

Product life cycle