Standard

IEC 60749-20:2002 ED1

Sep 2002 Revised

Note: Latest version: IEC 60749-20:2020 ED3

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat Revised IEC 60749-20:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Language: English/French Services: Online, Online + Pdf

Abstract

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.

Products specifications

Standard from IEC
Published: September 30 2002
Withdrawn: December 9 2008
Edition: 1
Document type: IS
Pages
ISBN: 2831865557

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Revised by: IEC 60749-20:2008 ED2
Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Partially replaces: IEC 60749:1996 ED2

IEC 60749-20:2002 ED1

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IEC 60749-20:2020 ED3

IEC 60749-20:2008 ED2