Standard

IEC 60749-20:2008 ED2

Dec 2008 Revised

Note: Latest version: IEC 60749-20:2020 ED3

Existing or new amendments and versions must be purchased separately.

Language English/French

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Abstract

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows: - to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; - reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; - update for lead-free solder; - correct certain errors in the original Edition 1.

Products specifications

Standard from IEC
Published: December 9 2008
Withdrawn: August 31 2020
Edition: 2
Document type: IS
Pages
ISBN: 9782889102846

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Revised by: IEC 60749-20:2020 ED3
Revised by: IEC 60749-20:2020 RLV
Adopted by: NF EN 60749-20:2010
Revises: IEC 60749-20:2002 ED1

IEC 60749-20:2008 ED2

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IEC 60749-20:2020 ED3