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IEC 61189-3:1997 ED1

Apr 1997 Revised

Note: Latest version: IEC 61189-3:2007 ED2

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Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) Revised IEC 61189-3:1997/AMD1:1999 ED1 Amendment from Publication date: Jul 1999 Pages: 33 Language: English, English/French Services: Online, Online + Pdf

Abstract

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.

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Standard from IEC
Published: April 10 1997
Withdrawn: October 9 2007
Edition: 1
Document type: IS
Pages
ISBN: 2831837545

Publisher: IEC
Distributor: IEC
ICS: 31.180
International TC: TC 91

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Revised by: IEC 61189-3:2007 ED2

IEC 61189-3:1997 ED1

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IEC 61189-3:2007 ED2

IEC 61189-3:1997+AMD1:1999 CSV ED1.1

IEC 61189-3:1997 ED1

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Version history Related Corrigenda and Amendments (1)

IEC 61189-3:1997/AMD1:1999 ED1

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IEC 61189-3:2007 ED2

IEC 61189-3:1997+AMD1:1999 CSV ED1.1

IEC 61189-3:1997 ED1

Abstract

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