Amendment

IEC 61189-3:1997/AMD1:1999 ED1

Jul 1999 Revised

Note: Latest version: IEC 61189-3:2007 ED2

Existing or new amendments and versions must be purchased separately.

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Standard
IEC 61189-3:2007 ED2
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Oct 2007 Current
Standard
IEC 61189-3:1997+AMD1:1999 CSV ED1.1
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Nov 2006 Revised
Standard
IEC 61189-3:1997 ED1
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Apr 1997 Revised

Products specifications

Amendment from IEC
Published: July 29 1999
Withdrawn: October 9 2007
Edition: 1
Document type: IS
Pages
ISBN: 2831848466

Publisher: IEC
Distributor: IEC
ICS: 31.180
International TC: TC 91

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Revised by: IEC 61189-3:2007 ED2
Amends: IEC 61189-3:1997 ED1

IEC 61189-3:1997/AMD1:1999 ED1

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IEC 61189-3:2007 ED2

IEC 61189-3:1997+AMD1:1999 CSV ED1.1

IEC 61189-3:1997 ED1

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Version history Related Corrigenda and Amendments (0)

Version history History (3)

IEC 61189-3:2007 ED2

IEC 61189-3:1997+AMD1:1999 CSV ED1.1

IEC 61189-3:1997 ED1

Products specifications

Product Relations

Product life cycle