IEC 61189-3:1997+AMD1:1999 CSV ED1.1

Nov 2006 Withdrawn

Note: Latest version: IEC 61189-3:2007 ED2

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Abstract

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment in addition to this publication.

Products specifications

Consolidated from IEC
Published: November 27 2006
Withdrawn: October 9 2007
Edition: 1.1
Document type: IS
Pages
ISBN:

Publisher: IEC
Distributor: IEC
ICS: 31.180
International TC: TC 91

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IEC 61189-3:1997+AMD1:1999 CSV ED1.1

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IEC 61189-3:2007 ED2