Standard

IEC 60749-21:2004 ED1

Mar 2004 Revised

Note: Latest version: IEC 60749-21:2011 ED2

Existing or new amendments and versions must be purchased separately.

Language English English/French

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Abstract

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Products specifications

Standard from IEC
Published: March 15 2004
Withdrawn: April 7 2011
Edition: 1
Document type: IS
Pages
ISBN: 2831874289

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Revised by: IEC 60749-21:2011 ED2
Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Replaces: IEC PAS 62173:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-21:2004 ED1

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IEC 60749-21:2011 ED2