Standard

IEC PAS 62173:2000 ED1

Aug 2000 Replaced

Existing or new amendments and versions must be purchased separately.

Language English

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Abstract

Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment. Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.

Products specifications

Standard from IEC
Published: August 22 2000
Withdrawn: March 15 2004
Edition: 1
Document type: PAS
Pages
ISBN: 2831852978

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Replaced by: IEC 60749-21:2004 ED1

IEC PAS 62173:2000 ED1

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Abstract

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Abstract

Products specifications

Product Relations

Product life cycle