Standard

IEC 60749-14:2003 ED1

Aug 2003 Current

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Language English/French

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Abstract

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Products specifications

Standard from IEC
Published: August 7 2003
Edition: 1
Document type: IS
Pages
ISBN: 2831871328

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Replaces: IEC PAS 62184:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-14:2003 ED1

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