Standard

IEC PAS 62184:2000 ED1

Aug 2000 Replaced

Existing or new amendments and versions must be purchased separately.

Language English

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Abstract

Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly.

Products specifications

Standard from IEC
Published: August 22 2000
Withdrawn: August 7 2003
Edition: 1
Document type: PAS
Pages
ISBN: 2831853087

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Replaced by: IEC 60749-14:2003 ED1

IEC PAS 62184:2000 ED1

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Abstract

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Abstract

Products specifications

Product Relations

Product life cycle