Standard

IEC 60749-10:2002 ED1

Apr 2002 Revised

Note: Latest version: IEC 60749-10:2022 ED2

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock Revised IEC 60749-10:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Language: English/French Services: Online, Online + Pdf

Abstract

Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. The contents of the corrigendum of August 2003 have been included in this copy.

Products specifications

Standard from IEC
Published: April 9 2002
Withdrawn: April 27 2022
Edition: 1
Document type: IS
Pages
ISBN: 2831862779

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Revised by: IEC 60749-10:2022 ED2
Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Replaces: IEC PAS 62186:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-10:2002 ED1

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IEC 60749-10:2022 ED2