Standard

IEC 60749-10:2022 ED2

Apr 2022 Current

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Language English/French

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Abstract

IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition: covers both unattached components and components attached to printed wiring boards; tolerance limits modified for peak acceleration and pulse duration; mathematical formulae added for velocity change and equivalent drop height.

Products specifications

Standard from IEC
Published: April 27 2022
Edition: 2
Document type: IS
Pages
ISBN: 9782832244937

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Adopted by: SN EN IEC 60749-10:2022
Revises: IEC 60749-10:2002 ED1

IEC 60749-10:2022 ED2

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