Standard

IEC TS 62396-5:2008 ED1

Aug 2008 Replaced

Existing or new amendments and versions must be purchased separately.

Language English

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Abstract

IEC TS 62396-5:2008 (E) provides a more precise definition of the threat that thermal neutrons pose to avionics as a second mechanism for inducing single event upset (SEU) in microelectronics. Addresses more in detail the following: detailed evaluation of the existing literature on measurements of the thermal flux inside of airliners; an enhanced compilation of the thermal neutron SEU cross section in currently available SRAM devices (more than 20 different devices).

Products specifications

Standard from IEC
Published: August 19 2008
Withdrawn: August 22 2014
Edition: 1
Document type: TS
Pages
ISBN: 2831899591

Publisher: IEC
Distributor: IEC
ICS: 03.100.50
ICS: 31.020
ICS: 49.060
International TC: TC 107

Product Relations

Replaced by: IEC 62396-5:2014 ED1
Replaces: IEC PAS 62396-5:2007 ED1

IEC TS 62396-5:2008 ED1

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