Standard

IEC 60749-9:2002 ED1

Apr 2002 Revised

Note: Latest version: IEC 60749-9:2017 ED2

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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking Revised IEC 60749-9:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Language: English/French Services: Online, Online + Pdf

Abstract

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.

Products specifications

Standard from IEC
Published: April 12 2002
Withdrawn: March 3 2017
Edition: 1
Document type: IS
Pages
ISBN: 2831862876

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Revised by: IEC 60749-9:2017 ED2
Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Replaces: IEC PAS 62175:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-9:2002 ED1

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IEC 60749-9:2017 ED2