Standard

IEC 60749-32:2002 ED1

Aug 2002 Current

Note: Latest version: IEC 60749-32:2002+AMD1:2010 CSV ED1.1

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Language English/French

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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) Current IEC 60749-32:2002/AMD1:2010 ED1 Amendment from Publication date: Jul 2010 Pages: 4 Language: English/French Services: Online, Online + Pdf
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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) Current IEC 60749-32:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Language: English/French Services: Online, Online + Pdf

Abstract

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.

Products specifications

Standard from IEC
Published: August 30 2002
Edition: 1
Document type: IS
Pages
ISBN: 2831865581

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Partially replaces: IEC 60749:1996 ED2

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Version history Related Corrigenda and Amendments (2)

IEC 60749-32:2002/AMD1:2010 ED1

IEC 60749-32:2002/COR1:2003 ED1

Version history History (2)

IEC 60749-32:2002+AMD1:2010 CSV ED1.1