Standard

IEC 60749-25:2003 ED1

Jul 2003 Current

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Language English/French

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Abstract

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Products specifications

Standard from IEC
Published: July 11 2003
Edition: 1
Document type: IS
Pages
ISBN: 2831871107

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Replaces: IEC PAS 62178:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-25:2003 ED1

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