Standard

IEC 60749-11:2002 ED1

Apr 2002 Current

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Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method Current IEC 60749-11:2002/COR2:2003 ED1 Corrigendum from Publication date: Aug 2003 Language: English/French Services: Online, Online + Pdf
Open product
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method Current IEC 60749-11:2002/COR1:2003 ED1 Corrigendum from Publication date: Jan 2003 Language: English/French Services: Online, Online + Pdf

Abstract

Defines the rapid change of temperature test method and the two-fluid-bath method. This test method may also be used, employing fewer cycles, to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. The contents of the corrigenda of January 2003 and August 2003 have been included in this copy.

Products specifications

Standard from IEC
Published: April 12 2002
Edition: 1
Document type: IS
Pages
ISBN: 2831862957

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Replaces: IEC PAS 62185:2000 ED1
Partially replaces: IEC 60749:1996 ED2

IEC 60749-11:2002 ED1

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