Standard

IEC TS 62647-3:2014 ED1

Feb 2014 Current

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Language English

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Abstract

IEC TS 62647-3:2014(E) defines for circuit card assemblies a default method for those companies that require a pre-defined approach, and a protocol for those companies that wish to develop their own test methods. The intent of this document is to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs that may be unable to develop methods specific to their own products and applications. It should be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing lead-free (Pb-free) solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of avionics electronic equipment.

Products specifications

Standard from IEC
Published: February 25 2014
Edition: 1
Document type: TS
Pages
ISBN: 9782832214565

Publisher: IEC
Distributor: IEC
ICS: 03.100.50
ICS: 31.020
ICS: 49.060
International TC: TC 107

Product Relations

Replaces: IEC PAS 62647-3:2011 ED1

IEC TS 62647-3:2014 ED1

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