Standard

IEC 63055:2016 ED1

Nov 2016 Revised

Note: Latest version: IEC 63055:2023 ED2

Existing or new amendments and versions must be purchased separately.

Language English

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There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

Products specifications

Standard from IEC
Published: November 8 2016
Withdrawn: October 11 2023
Edition: 1
Document type: IS
Pages
ISBN: 9782832236864

Publisher: IEC
Distributor: IEC
ICS: 31.180
ICS: 31.200
ICS: 35.060
International TC: TC 91

Product Relations

Revised by: IEC 63055:2023 ED2

Product life cycle

Current product

Revised

IEC 63055:2016 ED1
Stage 99.60
Revised by

Current

IEC 63055:2023 ED2

Extended editions Extended editions (0)

Version history Related Corrigenda and Amendments (0)

Version history History (2)

IEC 63055:2023 ED2