Standard

IEC 61760-2:2021 ED3

Jul 2021 Current

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Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide Current IEC 61760-2:2021 RLV Redline Publication date: Jul 2021 Language: English Services: Online, Online + Pdf

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Abstract

IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.

Products specifications

Standard from IEC
Published: July 16 2021
Edition: 3
Document type: IS
Pages
ISBN: 9782832249512

Publisher: IEC
Distributor: IEC
ICS: 31.240
International TC: TC 91

Product Relations

Adopted by: SN EN IEC 61760-2:2021
Revises: IEC 61760-2:2007 ED2
FRANKFURT AGREEMENT: prEN IEC 61760-2:2020

Product life cycle

Previous product

Revised

IEC 61760-2:2007 ED2
Current product

Current

IEC 61760-2:2021 ED3
Stage 60.60

IEC 61760-2:2021 ED3

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