IEC 61190-1-3:2007 ED2


Note: Latest version: IEC 61190-1-3:2017 ED3

Existing or new amendments and versions must be purchased separately.



IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.

Products specifications

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 2
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.190
  • International TC: TC 91

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