Standard

IEC 60749-8:2002 ED1

Aug 2002 Current

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Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing Current IEC 60749-8:2002/COR2:2003 ED1 Corrigendum from Publication date: Aug 2003 Language: English/French Services: Online, Online + Pdf
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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing Current IEC 60749-8:2002/COR1:2003 ED1 Corrigendum from Publication date: Apr 2003 Language: English/French Services: Online, Online + Pdf

Abstract

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

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Standard from IEC
Published: August 30 2002
Edition: 1
Document type: IS
Pages
ISBN: 283186559X

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

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Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Partially replaces: IEC 60749:1996 ED2

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Version history Related Corrigenda and Amendments (2)

IEC 60749-8:2002/COR2:2003 ED1

IEC 60749-8:2002/COR1:2003 ED1

Abstract

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