Standard

IEC 60749-3:2017 ED2

Mar 2017 Current

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Abstract

IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.

Products specifications

Standard from IEC
Published: March 3 2017
Edition: 2
Document type: IS
Pages
ISBN: 9782832240014

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Revises: IEC 60749-3:2002 ED1

IEC 60749-3:2017 ED2

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