Standard

IEC 60749-2:2002 ED1

Apr 2002 Current

Preview External link

Existing or new amendments and versions must be purchased separately.

Language English/French

Services Online + Pdf CHF 21.00 Online CHF 18.00

There are no extended editions available for this standard

Open product
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure Current IEC 60749-2:2002/COR1:2003 ED1 Corrigendum from Publication date: Aug 2003 Language: English/French Services: Online, Online + Pdf

Abstract

Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy.

Products specifications

Standard from IEC
Published: April 12 2002
Edition: 1
Document type: IS
Pages
ISBN: 2831862817

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

Product Relations

Partially replaces: IEC 60749:1996+AMD1:2000+AMD2:2001 CSV ED2.2
Partially replaces: IEC 60749:1996 ED2

Create subscription

Extended editions Extended editions (0)

Version history Related Corrigenda and Amendments (1)

IEC 60749-2:2002/COR1:2003 ED1

Abstract

Products specifications

Product Relations