Standard

IEC 60286-3:2013 ED5

May 2013 Revised

Note: Latest version: IEC 60286-3:2022 ED7

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Language English/French

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Abstract

IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

Products specifications

Standard from IEC
Published: May 17 2013
Withdrawn: January 16 2019
Edition: 5
Document type: IS
Pages
ISBN: 9782832208199

Publisher: IEC
Distributor: IEC
ICS: 31.020
ICS: 31.240
International TC: TC 40

Product Relations

Revised by: IEC 60286-3:2019 ED6
Revised by: IEC 60286-3:2019 RLV
Replaces: IEC 60286-3-1:2009 ED1
Replaces: IEC 60286-3-2:2009 ED1
Revises: IEC 60286-3:2007 ED4

IEC 60286-3:2013 ED5

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IEC 60286-3:2022 ED7

IEC 60286-3:2019 ED6