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IEC 60749-5:2023 ED3

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IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.

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  • Standard da IEC
  • Pubblicato:
  • Edizione: 3
  • Tipo di documento: IS
  • Pagine
  • Publisher IEC
  • Distributor IEC
  • ICS 31.080.01
  • International TC TC 47

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