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Standard

IEEE 1156.1-1993

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Abstract

New IEEE Standard - Inactive-Reserved. Fundamental information on minimum environmental withstand conditions is provided. The information is intended to be used in those cases in which a generic or detail specification for a certain module has been prepared. The intent is to achieve uniformity and reproducibility in the test conditions for all modules that may make up larger systems and are purported to have a rated environmental performance level. The specifications pertain to both the natural and artificial environments to which modules may be exposed. These conditions include, but are not limited to, thermal, mechanical, electrical, and atmospheric stresses.

Products specifications

  • Standard from IEEE
  • Published:
  • Withdrawn:
  • Document type: IS
  • Pages
  • Publisher: IEEE
  • Distributor: IEEE
  • ICS: 35.160
  • National Committee: IEEE Computer Society / Microprocessor Standards Committee

Product Relations

  • Referred by: IEEE 1101.2-1992
  • Refers: IEEE C63.4-2000
  • Refers: IEEE C63.12-1987
  • Refers: ASTM D2863-87, Standard Method for Measuring the Minimum Oxygen Concentration to Support Candle-Like
  • Refers: IEC 68-2-10 (1988), Basic Environmental Testing Procedures, Part 2: Test J and guidance: Mould growth.
  • Refers: IEC 68-2-11 (1981), Basic Environmental Testing Procedures, Part 2: Test Ka: Salt mist
  • Refers: IEC 68-2-3 (1969), Basic Environmental Testing Procedures, Part 2: Test Ca: Damp heat, steady state.
  • Refers: Federal Communications CommiIEC 50, International
  • Refers: ASTM B827-92, Standard Practice for Conducting Mixed Flowing Gas (MFG) Environmental Testing.4
  • Refers: Combustion of Plastics (Oxygen Index).
  • Refers: IEC 68-2-2 (1974), Basic Environmental Testing Procedures, Part 2: Test B: Dry heat.
  • Refers: IEC 68-2-6 (1982), Basic Environmental Testing Procedures, Part 2: Test Fc and guidance: Vibration (sinusoidal).
  • Refers: IEC 68-2-1 (1990), Basic Environmental Testing Procedures, Part 2: Test A: Cold.5