Standard

IEC PAS 62190:2000 ED1

Nov 2000 Replaced

Existing or new amendments and versions must be purchased separately.

Language English

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Abstract

Aims at identifying the classification level of nonhermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation.

Products specifications

Standard from IEC
Published: November 28 2000
Withdrawn: January 31 2002
Edition: 1
Document type: PAS
Pages
ISBN: 2831854687

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

IEC PAS 62190:2000 ED1

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Abstract

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Abstract

Products specifications

Product life cycle