Standard

IEC PAS 62174:2000 ED1

Aug 2000 Replaced

Existing or new amendments and versions must be purchased separately.

Language English

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Abstract

Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Products specifications

Standard from IEC
Published: August 22 2000
Withdrawn: March 31 2003
Edition: 1
Document type: PAS
Pages
ISBN: 283185301X

Publisher: IEC
Distributor: IEC
ICS: 31.080.01
International TC: TC 47

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Replaced by: IEC 60749-15:2003 ED1

IEC PAS 62174:2000 ED1

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Abstract

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Abstract

Products specifications

Product Relations

Product life cycle