Standard

IEC 62951-1:2017 ED1

Apr 2017 Current

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Language English

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Abstract

IEC 62951-1:2017(E) specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates. Conductive thin films on flexible substrates are extensively used in flexible electronic devices and flexible semiconductors. Conductive thin films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film. The electrical and mechanical behaviours of thin films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions and adhesion between the film and substrate. The object of this standard is to establish simple and repeatable test methods for evaluating the electromechanical properties or flexibility of conductive thin films on flexible substrate. The bending test methods include outer bending test and inner bending test.

Products specifications

Standard from IEC
Published: April 10 2017
Edition: 1
Document type: IS
Pages
ISBN: 9782832238967

Publisher: IEC
Distributor: IEC
ICS: 31.080.99
International TC: TC 47

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Adopted by: NF EN 61558-2-4:1999
Adopted by: SN EN 61558-2-4:1997

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Abstract

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