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Standard

IEC 61760-2:2007 ED2

Revidiert

Hinweis: Neuste Ausgabe: IEC 61760-2:2021 ED3

Vorschau

Bestehende oder zukünftige Amendments und Versionen müssen separat erworben werden.

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Zusammenfassung

IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.

Produktspezifikationen

  • Standard von IEC
  • Ausgabedatum:
  • Rückzugsdatum:
  • Edition: 2
  • Dokumenttyp: IS
  • Seiten
  • Herausgeber: IEC
  • Lieferant: IEC
  • ICS: 31.240
  • Internationales Komitee: TC 91

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