Standard

IEC 62137-1-3:2008 ED1

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The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Specifiche dei prodotti

  • Standard da IEC
  • Pubblicato:
  • Edizione: 1
  • Tipo di documento: IS
  • Pagine
  • Publisher IEC
  • Distributor IEC
  • ICS 31.190
  • International TC TC 91