Standard

IEC 61189-1:1997 ED1

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Astratto

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

Specifiche dei prodotti

  • Standard da IEC
  • Pubblicato:
  • Edizione: 1
  • Tipo di documento: IS
  • Pagine
  • Publisher IEC
  • Distributor IEC
  • ICS 31.180
  • International TC TC 91