Standard

IEC PAS 62084:1998 ED1

Radié

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Résumé

Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect, Micro Ball Grid Array, Micro Surface Mount Technology and Slightly Larger than Integrated Circuit Carrier.

Spécifications des produits

  • Standard de IEC
  • Publié:
  • Radié:
  • Version: 1
  • Type de document: PAS
  • Pages
  • Editeur: IEC
  • Distributeur: IEC
  • ICS: 31.200
  • Comité international: TC 91