Standard

SAE SSB1_002

Current

Existing or new amendments and versions must be purchased separately.

Language
Services

Abstract

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications. This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

Products specifications

  • Standard from SAE International
  • Published:
  • Document type: IS
  • Pages
  • Publisher: SAE International
  • Distributor: SAE International

Product Relations