Standard

ISO/TS 10303-1698:2006

Dec 2006 Withdrawn

Existing or new amendments and versions must be purchased separately.

Language English

Services Online + Pdf CHF 0,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

ISO/TS 10303-1698:2006 specifies the application module for Layered interconnect module design. The following are within the scope of ISO/TS 10303-1698:2006: design features; material stackup; design patterns; metalization; functional and physical network listing; design layers; artwork layers; passages; items within the scope of application module Component grouping, ISO/TS 10303-1656; items within the scope of application module Edge shape feature, ISO/TS 10303-1673; items within the scope of application module Footprint definition, ISO/TS 10303-1646; items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684; items within the scope of application module Interconnect module usage view, ISO/TS 10303-1686; items within the scope of application module Interconnect physical requirement allocation, ISO/TS 10303-1689; items within the scope of application module Part template extension, ISO/TS 10303-1718; items within the scope of application module Physical connectivity definition, ISO/TS 10303-1755.

Products specifications

Standard from ISO
Published: December 14 2006
Withdrawn: May 18 2010
Edition: 1
Document type: TS
Pages
ISBN:

Publisher: ISO
Distributor: ISO
ICS: 25.040.40
International TC: ISO/TC 184/SC 4

Extended editions Extended editions (0)

Version history Related Corrigenda and Amendments (0)

Abstract

Products specifications