Standard

IEC TR 61760-5-1:2024 ED1

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Abstract

IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 1
  • Document type: TR
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.190
  • International TC: TC 91