Standard

IEC 62258-6:2006 ED1

Current

Existing or new amendments and versions must be purchased separately.

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Abstract

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 1
  • Document type: IS
  • Pages
  • ISBN: 2831887860
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.080.99
  • International TC: TC 47