IEC 62148-21:2019 ED1


Note: Latest version: IEC 62148-21:2021 ED2

Existing or new amendments and versions must be purchased separately.



IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. Keywords: electrical interface of photonic integrated circuit (PIC) packages

Products specifications

  • Standard from IEC
  • Published:
  • Withdrawn:
  • Edition: 1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 33.180.20
  • International TC: TC 86/SC 86C

Product Relations

Product life cycle