Standard

IEC 62137-4:2014 ED1

Oct 2014 Current

Existing or new amendments and versions must be purchased separately.

Language English/French

Services Online + Pdf CHF 284,00 Online CHF 243,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004: - test conditions for use of lead-free solder are included; - test conditions for lead-free solders are added; - accelerations of the temperature cycling test for solder joints are added.

Products specifications

Standard from IEC
Published: October 9 2014
Edition: 1
Document type: IS
Pages
ISBN: 9782832218730

Publisher: IEC
Distributor: IEC
ICS: 31.190
International TC: TC 91

Product Relations

Replaces: IEC 62137:2004 ED1

IEC 62137-4:2014 ED1

Create subscription