Standard

IEC 62137:2004 ED1

Jul 2004 Replaced

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Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN Replaced IEC 62137:2004/COR1:2005 ED1 Corrigendum from Publication date: Jan 2005 Language: English Services: Online, Online + Pdf

Abstract

This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.

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Standard from IEC
Published: July 6 2004
Withdrawn: October 9 2014
Edition: 1
Document type: IS
Pages
ISBN: 2831875293

Publisher: IEC
Distributor: IEC
ICS: 31.190
International TC: TC 91

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Replaced by: IEC 62137-4:2014 ED1

IEC 62137:2004 ED1

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IEC 62137:2004/COR1:2005 ED1

Abstract

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Product life cycle