IEC 61837-2:2018 ED3


Note: Latest version: IEC 61837-2:2018+AMD1:2020 CSV

Existing or new amendments and versions must be purchased separately.

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IEC 61837-2:2018 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition: a. revision of the figures to match the notation of the drawings of IEC 61240:2016; b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C. As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 3
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.140
  • International TC: TC 49

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