Search scope:
Shopping cart (0)
Consolidated

IEC 61837-2:2011+AMD1:2014 CSV

Revised

Note: Latest version: IEC 61837-2:2018+AMD1:2020 CSV

Preview

Existing or new amendments and versions must be purchased separately.

Language
Services

Abstract

IEC 61837-2:2011+A1:2014 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240. In this edition, types of enclosures are renamed to express their features in their names for better understanding. The relative comparison of new types with old ones is listed in Table 1. New names of enclosures express configuration type, terminal lead numbers, sizes and arrangement of terminal pads. The details of definition are shown in Clause 3: Configuration of enclosures, and Clause 4: Designation of types. Enclosures in this new edition are based on IEC 61240. In this standard, 27 enclosures are added to the first edition of IEC 61837-2. This publication is to be read in conjunction with IEC 61240:1994. This consolidated version consists of the second edition (2011) and its amendment 1 (2014). Therefore, no need to order amendment in addition to this publication.

Products specifications

  • Consolidated from IEC
  • Published:
  • Withdrawn:
  • Edition: 2.1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.140
  • International TC: TC 49

Product Relations

Product life cycle