Standard

IEC 61191-2:2013 ED2

Jun 2013 Revised

Note: Latest version: IEC 61191-2:2017 ED3

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Abstract

IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: - IPC-A-610 on workmanship has been included as a normative reference; - some of the terminology used in the document has been updated; - references to IEC standards have been corrected; - the use of lead-free solder paste and plating are addressed.

Products specifications

Standard from IEC
Published: June 5 2013
Withdrawn: May 23 2017
Edition: 2
Document type: IS
Pages
ISBN: 9782832208564

Publisher: IEC
Distributor: IEC
ICS: 31.190
ICS: 31.240
International TC: TC 91

Product Relations

Revised by: IEC 61191-2:2017 ED3
Revises: IEC 61191-2:1998 ED1

IEC 61191-2:2013 ED2

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IEC 61191-2:2017 ED3