Standard

IEC 61189-2:1997 ED1

Apr 1997 Revised

Note: Latest version: IEC 61189-2:2006 ED2

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Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures Revised IEC 61189-2:1997/AMD1:2000 ED1 Amendment from Publication date: Jan 2000 Pages: 37 Language: English Services: Online, Online + Pdf

Abstract

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

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Standard from IEC
Published: April 10 1997
Withdrawn: May 30 2006
Edition: 1
Document type: IS
Pages
ISBN: 2831837537

Publisher: IEC
Distributor: IEC
ICS: 31.180
International TC: TC 91

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Revised by: IEC 61189-2:2006 ED2
Replaces: IEC 60249-1:1982 ED2

IEC 61189-2:1997 ED1

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IEC 61189-2:2006 ED2

IEC 61189-2:1997 ED1

IEC 60249-1:1982/AMD4:1993 ED2

IEC 60249-1:1982/AMD3:1991 ED2

IEC 60249-1:1982/AMD2:1989 ED2

IEC 60249-1:1982/AMD1:1984 ED2

IEC 60249-1:1982 ED2

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Version history Related Corrigenda and Amendments (1)

IEC 61189-2:1997/AMD1:2000 ED1

Version history History (7)

IEC 61189-2:2006 ED2

IEC 61189-2:1997 ED1

IEC 60249-1:1982/AMD4:1993 ED2

IEC 60249-1:1982/AMD3:1991 ED2

IEC 60249-1:1982/AMD2:1989 ED2

IEC 60249-1:1982/AMD1:1984 ED2

IEC 60249-1:1982 ED2

Abstract

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