Standard

IEC 61189-1:1997 ED1

Current

Note: Latest version: IEC 61189-1:1997+AMD1:2001 CSV

Existing or new amendments and versions must be purchased separately.

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Abstract

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 1
  • Document type: IS
  • Pages
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.180
  • International TC: TC 91