IEC 61188-6-2:2021 ED1


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IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

Products specifications

  • Standard from IEC
  • Published:
  • Edition: 1
  • Document type: IS
  • Pages
  • ISBN: 9782832293546
  • Publisher: IEC
  • Distributor: IEC
  • ICS: 31.180
  • ICS: 31.190
  • International TC: TC 91

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